Typically, small adhesive bonds are formed under rapidly increased and stabilized temperature conditions, and then tested – usually in lap shear mode — immediately after a range of selected formation times. This enables isothermal bond strength accumulation with time to be explored. Repetition for a range of temperatures enables bond strength development characteristics and strength maxima to be evaluated as a function of temperature. Automation enables data sets to be collected quickly.
Some example strength dynamics data — for amino resin to bio-polymer bonds, and derived regressed development rate with temperature:
The instrument may be used for diverse applications. For example, to evaluate the thermal damage dynamics of sample bonds at temperatures up to 265°C.
Example thermal damage effects as a function of time and temperature:
The platform may be configured for diverse bond forming and testing orientations and formats. A wide range of transducers for load, position and fluid pressure logging and control may be installed. The user friendly software is configured for such diverse applications.