The Automated Bonding Evaluation System (ABES) is a desktop instrument which enables the dynamics of adhesion to be evaluated: how fast adhesive bonds develop their strength under a wide range of precisely and dynamically controlled thermal, chemical and stress conditions.
The ABES platform may be adapted to perform many functions — such as dynamic chemical injection, high temperature thermal damage assessment, dynamic bond cooling, micro-bond testing, diverse bond formats, dynamic loading.
AES has expertise in deterministic process modeling. We provide understanding of the micro-environments under which adhesives must transform within products during their manufacture. To complement modeling, a suite of automated laboratory techniques to provide material property input data as functions of diverse process conditions is available.